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Emerson and CoreTigo Join Forces to Showcase Wireless Floor to Cloud Packaging Solutions at PACK EXPO 2023

August 24, 2023

Emerson and CoreTigo Join Forces to Showcase Wireless Floor to Cloud Packaging Solutions at PACK EXPO 2023

Emerson and CoreTigo are set to showcase the new era of packaging solutions with industrial wireless automation at the upcoming PACK EXPO, 2023. With CoreTigo’s IO-Link Wireless solutions, and Emerson’s revolutionary future of automation technologies, packaging machine builders and manufacturers can now achieve new enhanced capabilities and solve critical challenges for packaging machines in Consumer- Packaged Goods and other challenging fields.

This collaboration allows a combination of never-before-possible degrees of flexibility and agility in packaging machines. Utilizing industrial-grade wireless connectivity specifically tailored for factory automation has given packaging machinery vast capabilities in both control and monitoring, thus unlocking trapped data, and enhancing their production, while achieving these key highlights:

  • Reduced Changeover Time: The integration of adaptive packaging machines powered by IO-Link Wireless automation solutions enables seamless transitions between different product and package types. This innovation significantly reduces changeover time, enhancing overall efficiency and minimizing downtime.
  • Machine Footprint Reduction: By virtue of its compact and optimized design, the adaptive machine takes up less floor space and requires fewer external equipment and robotics. This streamlined layout contributes to a more efficient and space-effective manufacturing environment.
  • Maximum Capacity: The adaptive packaging machine operates at its maximum capacity, ensuring that productivity and throughput are optimized. This capability not only accelerates production but also maximizes return on investment.
  • Full Flexibility: Offering unparalleled versatility, the adaptive machine supports multiple product and package types, catering to diverse production requirements. This adaptability allows manufacturers to swiftly respond to changing market demands without compromising efficiency.
  • Sustainability: The collaborative efforts of Emerson and CoreTigo result in a more sustainable manufacturing process. With reduced energy consumption, minimized space requirements, and optimized part utilization, the adaptive machine promotes eco-friendly practices and resource efficiency.

PACK EXPO 2023 will take place September 11-13, 2023, where visitors will have the opportunity to view these latest innovations in packaging machinery, as well as meet Emerson and CoreTigo representatives at Emerson’s booth: South Lower Hall, Booth 6107.

About IO-Link Wireless

IO-Link Wireless is a deterministic, low latency (5 msec) and low synchronization rates (10’s of micro seconds), highly-reliable and scalable universal wireless communication protocol. Based on the IO-Link IEC 61131-9 standard, it is designed specifically for factory automation, coexisting with other networks – both wired and wireless.

About Emerson

Emerson (NYSE: EMR) is a global technology and software company providing innovative solutions for the world’s essential industries. Through its leading automation portfolio, including its majority stake in AspenTech, Emerson helps hybrid, process and discrete manufacturers optimize operations, protect personnel, reduce emissions and achieve their sustainability goals. For more information, visit Emerson.com.

About CoreTigo

CoreTigo enables faster and more flexible manufacturing by providing high-performance machine digitalization, wireless connectivity and edge solutions for machine builders, system integrators and industrial equipment manufacturers. CoreTigo’s products enable the design and retrofit of machines and production lines that were not possible before. These solutions increase flexibility, adaptivity and modularity, resulting in cost effectiveness, increased productivity and downtime reduction. Embraced by industrial leaders, CoreTigo’s solutions are based on the IO-Link Wireless global standard, which is fit for harsh factory environments and motion control applications, providing the most reliable wireless connectivity for millions of sensors, actuators and industrial devices worldwide.

More Information

To schedule a personal meeting, visit https://www.coretigo.com/coretigo-pack-expo-2023-las-vegas/

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CoreTigo’s Transforming Wireless Technology Enables Adaptive Packaging Machines at PACK EXPO 2023

CoreTigo, a leading provider of Industrial Wireless Automation solutions, is set to showcase its cutting-edge industrial wireless automation solutions for packaging machines and intelligent conveying systems at PACK EXPO 2023. CoreTigo will be demonstrating the unique capabilities and new applications enabled by cable-grade industrial wireless connectivity in collaboration both with the Rotzinger group and Rockwell Automation.

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